EXTREME PERFORMANCE: Straight-fin design with twice the height of other heatsinks for extra heat dissipation performance whether actively or passively cooled. Mandatory for applications in high temperature, sealed, or overclocked applications. Heatsinks increase the surface area for heat transfer but still requires temperature gradient to be effective. | LONG LASTING EXACT FIT: CPU and LAN chipset heatsinks are fabricated specifically for the Raspberry Pi 4 Model B. Double-sided thermal transfer tape offers high thermal conductivity and long lasting adhesion in all mounting scenarios. | QUICK AND SIMPLE INSTALLATION: Peel and stick in the orientation with the most airflow. Most effective solution for reliable performance and longevity. No more messy thermal paste and compatible with LoveRPi Power over Ethernet HAT v2 for Raspberry Pi 4. | MAXIMUM FREQUENCY FOR LONGER: Maintain 1.5GHz for more than a minute before throttling kicks in. That is 5x longer than without a heatsink. Decrease idle temperatures by 20°F for longer component life and more reliable operation. | MUST HAVE FOR RASPBERRY PI 4: The SoC and USB 3.0 bridge require heatsinks since they exceed 50°C. Other components like LPDDR4 and gigabit PHY are best passively cooled since they are near components with higher z-height that may short circuit. Please attach the heatsinks as pictured to avoid accidental damage to the Raspberry Pi 4 Model B board.